Metal sputtering targets
Time：2021-11-06 Author：Changsha Xinkang scientific research material service platform
The sputtering target is mainly composed of a target blank, a back plate and other parts. Among them, the target blank is the target material bombarded by high-speed ion beams and belongs to the core part of the sputtering target. During the sputtering coating process, the target blank is hit by ions After that, the surface atoms are scattered by sputtering and deposited on the substrate to form an electronic thin film; due to the low strength of high-purity metal, the sputtering target needs to be installed in the machine used to complete the sputtering process, and the inside of the machine is High voltage and high vacuum environment, therefore, the sputtering target blank of ultra-high purity metal needs to be joined with the backplate through different welding processes. The backplate mainly plays the role of fixing the sputtering target, and needs to have good Electrical and thermal conductivity.
Market application of metal sputtering targets
Many products in common use today have coatings formed by sputtering targets. These coatings include:
Semiconductor
Most modern electronics contain basic components produced using tantalum sputtering targets. These include microchips, memory chips, printheads, flat panel displays, and more.
Glass coating
Sputtering targets are used to produce low-emissivity coated glass (also known as Low-E glass), which is commonly used in building construction due to its ability to save energy, control light, and be aesthetically pleasing.
Solar cell coating
The demand for renewable energy is on the rise. The third-generation thin-film solar cells are fabricated by sputtering coating technology.
Metal sputtering targets provided by Xinkang
| Name | Purity | Name | Purity |
| 银(Ag) | 3N5-5N | 铝(Al) | 4N-6N |
| 金(Au) | 4N-5N | 砷(As) | 2N-4N |
| 硼(B)) | 2N-6N | 铍(Be) | 2N-3N |
| 铋(Bi) | 4N-5N | 石墨/碳(C) | 3N-5N |
| 钙(Ca) | 3N | 镉(Cd) | 4N-5N |
| 铈(Ce) | 3N-4N | 钴(Co) | 3N-4N |
| 铬(Cr) | 2N5-3N5 | 铜(Cu) | 3N5-6N |
| 镝(Dy) | 3N-4N | 铒(Er) | 3N-4N |
| 铕(Eu) | 3N-4N | 铁(Fe) | 3N-4N |
| 镓(Ga) | 5N-7N | 钆(Gd) | 3N-4N |
| 锗(Ge) | 5N | 铪(Hf) | 3N-4N |
| 钬(Ho) | 2N5-3N | 铟(In) | 4N-5N |
| 铱(Ir) | 3N5 | 镧(La) | 3N-4N |
| 锂(Li) | 3N | 镥(Lu) | 3N-4N |
| 镁(Mg) | 3N5-4N | 锰(Mn) | 3N-4N |
| 钼(Mo) | 3N5-4N | 铌(Nb) | 3N5-4N5 |
| 钕(Nd) | 2N5-3N5 | 镍(Ni) | 2N5-5N |
| 锇(Os) | 3N5 | 铅(Pb) | 4N |
| 钯(Pd) | 3N5 | 镨(Pr) | 2N5-3N |
| 铂(Pt) | 3N5-4N | 铼(Re) | 3N5 |
| 铑(Rh) | 3N5 | 钌(Ru) | 3N5 |
| 锑(Sb) | 3N5-5N | 钪(Sc) | 3N5 |
| 硒(Se) | 3N-5N | 硅(Si) | 5N-7N |
| 钐(Sm) | 3N5 | 锡(Sn) | 3N5-5N |
| 锶(Sr) | 3N | 钽(Ta) | 3N5-4N |
| 铽(Tb) | 3N5 | 碲(Te) | 4N-6N |
| 钛(Ti) | 2N5-5N | 铥(Tm) | 2N5-3N5 |
| 钒(V) | 3N5-4N | 钨(W) | 3N5-5N |
| 钇(Y) | 3N5 | 镱(Yb) | 3N5 |
| 锌(Zn) | 3N5-5N | 锆(Zr) | 2N5-3N5 |
Related sputtering targets
· tungsten titanium (WTi) target
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