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Tungsten copper alloy / WCu bar $ 80.00

High purity 3N (99.9%) Tungsten copper alloy bar / WCu bar, The price is for reference only, please contact customer service for quotation!!!

element : WCu     

purity : 3N     

shape : plate     

weight : 1Kg     

Package : Three-layer vacuum packaging or argon gas protection, in line with IATA, DOT packaging specification     

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Product details

Market reference price: $80.00 , The price is for reference only, please contact customer service for quotation.

Product Name: Tungsten copper alloy bar / WCu bar / Tungsten copper high specific gravity alloy bar

Specifications: Various specifications and sizes can be customized according to customer requirements.

Physical and chemical properties

Tungsten copper alloy is an alloy composed of tungsten and copper. The copper content of commonly used alloys is 10% to 50%. The alloy is prepared by powder metallurgy and has good electrical and thermal conductivity, good high temperature strength and plasticity. At very high temperatures, such as above 3000 °C, the copper in the alloy is liquefied and evaporated, which absorbs a large amount of heat and reduces the surface temperature of the material. Therefore, this type of material is also called metal sweating material. Tungsten-copper composite material is a two-phase structure pseudo-alloy mainly composed of tungsten and copper elements. It is a metal matrix composite material. Due to the large difference in physical properties between metal copper and tungsten, it cannot be produced by melting and casting method, and powder alloy is generally used. technology to produce.

Copper Tungsten Material Index Parameters

Tungsten 50 balance copper, density 11.85g/cm³, hardness 65HB, conductivity 55%IACS;

Tungsten 55 balance copper, density 12.30g/cm³, hardness 70HB, conductivity 50%IACS;

Tungsten 70 balance copper, density 13.85g/cm³, hardness 85HB, conductivity 45%IACS;

Tungsten 75 balance copper, density 14.50g/cm³, hardness 90HB, conductivity 40%IACS;

Tungsten 80 balance copper, density 15.15g/cm³, hardness 98HB, conductivity 34%IACS;

Tungsten 85 balance copper, density 15.90g/cm³, hardness 240HB, conductivity 30%IACS;

Tungsten 85 balance copper, density 16.75g/cm³, hardness 260HB, conductivity 27%IACS

Applications of copper tungsten material

Copper-tungsten alloy is an alloy composed of tungsten and copper. It combines the advantages of copper and tungsten. For example, this alloy has the advantages of high strength, high specific gravity, high temperature resistance, arc ablation resistance, good electrothermal performance, and good processing performance. Therefore, it is widely used in industry and our daily life.

1. Application of copper-tungsten alloy in military high temperature resistant materials
This alloy is resistant to high temperatures and is used in aerospace as nozzles, gas rudders and air rudders for missile and rocket engines. At this time, the principle of sweating and cooling effect formed by copper volatilization at high temperature (copper melting point of 1083 ° C) is used to reduce the surface temperature of tungsten copper and ensure its use under extreme high temperature conditions.

2. The use of copper-tungsten alloy in high-voltage switches

This alloy is widely used in high voltage switches. The main reason is that tungsten-copper alloy has special advantages such as resistance to arc ablation, resistance to fusion welding, small cut-off current, and low thermal electron emission capability.

3. The use of copper-tungsten alloy in electric machining electrodes
The advantages of tungsten copper electrodes are high temperature resistance, high temperature strength, arc ablation resistance, good electrical and thermal conductivity, and fast heat dissipation. Its applications are mainly concentrated on EDM electrodes, resistance welding electrodes and high voltage discharge tube electrodes.

The characteristics of electric machining electrodes are many specifications, small batches, and large totals. Tungsten-copper materials used as electromechanical electrodes should have the highest possible tissue density and uniformity, especially for those elongated rod-shaped, tubular, and shaped electrodes.

4. Application of tungsten copper alloy in microelectronic materials
Tungsten copper electronic packaging and heat dissipation materials combine the low expansion properties of tungsten with the high thermal conductivity of copper. Its thermal expansion coefficient and thermal conductivity can be changed by adjusting the composition of tungsten copper, thus providing a wider range of applications for tungsten copper.
Tungsten copper material has high heat resistance and good thermal conductivity, and has a thermal expansion coefficient that matches silicon wafer, gallium arsenide, and ceramic materials, so it is widely used in semiconductor materials, suitable for high-power device packaging materials, Heat dissipation materials, heat dissipation components, ceramics, gallium arsenide substrates, etc.