High Purity Tin Metal (Sn)
Material Type | Tin |
---|---|
Symbol | Sn |
Atomic Weight | 118.71 |
Atomic Number | 50 |
Color/Appearance | Silvery Lustrous Gray, Metallic |
Thermal Conductivity | 66.6 W/m.K |
Melting Point (°C) | 232 |
Coefficient of Thermal Expansion | 22 x 10-6/K |
Theoretical Density (g/cc) | 7.28 |
Overview
Physical properties: CAS number: 7440-31-5; Density: 7.28 g/cm3 Melting point: 231.89°C Boiling point: 2260°C
Physical form: can be customized according to customer needs
Usage: Mainly used for preparing family compound semiconductors (such as PbxSn1-xTe), high purity alloys, ultra-low temperature cooling alloys, superconducting materials (Nb2Sn), solders and dopants for compound semiconductors. Basic materials such as ITO materials.
Item | Purity | Main Impurities | Total Impurities | Test Method |
---|---|---|---|---|
High Purity Tin | 99.99% | Mg, Al, Si, P, S, V, Cr, Mn, Fe, Co, Cu, Zn, Ag | <100ppm | ICP-MS |
Ultra Pure Tin | 99.995% | <50ppm | GDMS | |
Utra High Purity Tin | 99.999% | <10ppm | GDMS |