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Tin 99.99%-99.999%

High Purity Tin Metal (Sn)

Material TypeTin
Atomic Weight118.71
Atomic Number50
Color/AppearanceSilvery Lustrous Gray, Metallic
Thermal Conductivity66.6 W/m.K
Melting Point (°C)232
Coefficient of Thermal Expansion22 x 10-6/K
Theoretical Density (g/cc)7.28

Physical properties: CAS number: 7440-31-5; Density: 7.28 g/cm3 Melting point: 231.89°C Boiling point: 2260°C

Physical form: can be customized according to customer needs

Usage: Mainly used for preparing family compound semiconductors (such as PbxSn1-xTe), high purity alloys, ultra-low temperature cooling alloys, superconducting materials (Nb2Sn), solders and dopants for compound semiconductors. Basic materials such as ITO materials.

ItemPurityMain ImpuritiesTotal ImpuritiesTest Method
High Purity Tin99.99%Mg, Al, Si, P, S, V, Cr, Mn, Fe, Co, Cu, Zn, Ag<100ppmICP-MS
Ultra Pure Tin99.995%<50ppmGDMS
Utra High Purity Tin99.999%<10ppmGDMS