Copper Sputtering Targets (Copper)

Copper Sputtering Targets (Cu) Information

Copper, element symbol is Cu, density 8.92g/cm ³， Melting point 1083.4 ± 0.2 ℃, boiling point 2567 ℃, copper is a metal with a purple red luster, slightly hard, extremely tough, wear-resistant, and has good ductility, good thermal conductivity, conductivity, and corrosion resistance. Copper and its alloys are very stable in dry air and are widely used in fields such as electrical, mechanical manufacturing, construction industry, transportation, etc.

We produce copper targets up to 99.9999% using smelting technology. Low gas content. The particle size distribution is uniform.

Copper target is one of the sputtering targets in the vacuum deposition industry. It is a product of high-purity copper materials after series processing, with specific size and shape. In particular, ultrahigh purity copper has many excellent characteristics and has been widely used in ion beam sputtering, Magnetron sputtering, etc. It can be plated with reflective film, conductive film, semiconductor film, capacitor film, decorative film, protective film, integrated circuit, display, etc,

The following pictures are two typical micrometallographic examination pictures of copper sputtering targets, with average particle size <50um.

We sell these different shape copper metal materials by unit weight or piece for different use in research area and for new proprietary technologies.Actual prices can vary and may be higher or lower, as determined by availability and market fluctuations. To speak to someone directly about current pricing, please click inquiry.

Cu-4N5-COA