EN 
AR
BG
HR
CS
DA
NL
FI
FR
DE
HI
IT
JA
KO
NO
PL
PT
RO
RU
ES
SV
TL
ID
LT
SR
SK
SL
UK
VI
ET
HU
TH
TR
MS
GA
CY
BE
KA
BN
BS
MN
NE
MY
TG
UZ
LB
Titanium Sputtering Targets (Ti)
| Material | Titanium |
|---|---|
| Forms | Planar,Rotary |
| Purity | 99.7%-99.999% |
| Size | Circular:Diameter≤14 inches, Thickness≥1mm;Plate:L≤32 inches, W:≤12 inches, Thickness≥1mm |
| Process | Melting |
| Analysis | GDMS, ICP-OES, XRF |
| Packaging | Vacuum (standard export packing) |
| Applications | Thin film materials, semiconductor, laboratory research |
Overview
Titanium Sputtering Targets (Ti) Information
Titanium chemical symbol Ti, atomic number 22.The melting point of titanium is 1660℃, boiling point is 3287℃, density is 4.54g/cm².Titanium is a gray transition metal characterized by light weight, high strength and good corrosion resistance.Because of its stable chemical properties, good resistance to high temperature, low temperature, strong acid, strong alkali, high strength and low density, titanium has two outstanding advantages.
| Material Type | Titanium |
| Symbol | Ti |
| Atomic Weight | 47.867 |
| Atomic Number | 22 |
| Color/Appearance | Silvery Metallic |
| Thermal Conductivity | 21.9 W/m.K |
| Melting Point (°C) | 1,660 |
| Coefficient of Thermal Expansion | 8.6 x 10-6/K |
| Theoretical Density (g/cc) | 4.5 |
| Z Ratio | 0.628 |
| Sputter | DC |
| Max Power Density | 50* |
| (Watts/Square Inch) | |
| Type of Bond | Indium, Elastomer |
| Comments | Alloys with W/Ta/Mo; evolves gas on first heating. |
Our titanium target up to 99.999%, and smelting technology is adopted. Low gas content and uniform particle size distribution
In the electronic field, titanium targets are mainly used to manufacture semiconductor devices and flat panel displays.
In the optical field, titanium targets are used to manufacture thin film mirrors, filters, etc.
In the field of magnetic materials, titanium targets are used to make magnetic films, etc.
Ti-4N-COA
