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Metal Sputtering Targets

Titanium Sputtering Targets (Ti)


MaterialTitanium
FormsPlanar,Rotary
Purity99.7%-99.999%
SizeCircular:Diameter≤14 inches, Thickness≥1mm;Plate:L≤32 inches, W:≤12 inches, Thickness≥1mm
ProcessMelting
AnalysisGDMS, ICP-OES, XRF
PackagingVacuum (standard export packing)
ApplicationsThin film materials, semiconductor, laboratory research
Overview

Titanium Sputtering Targets (Ti) Information

Titanium chemical symbol Ti, atomic number 22.The melting point of titanium is 1660℃, boiling point is 3287℃, density is 4.54g/cm².Titanium is a gray transition metal characterized by light weight, high strength and good corrosion resistance.Because of its stable chemical properties, good resistance to high temperature, low temperature, strong acid, strong alkali, high strength and low density, titanium has two outstanding advantages.

Material TypeTitanium
SymbolTi
Atomic Weight47.867
Atomic Number22
Color/AppearanceSilvery Metallic
Thermal Conductivity21.9 W/m.K
Melting Point (°C)1,660
Coefficient of Thermal Expansion8.6 x 10-6/K
Theoretical Density (g/cc)4.5
Z Ratio0.628
SputterDC
Max Power Density50*
(Watts/Square Inch)
Type of BondIndium, Elastomer
CommentsAlloys with W/Ta/Mo; evolves gas on first heating.


Ti
Ti1


Our titanium target up to 99.999%, and smelting technology is adopted. Low gas content and uniform particle size distribution

In the electronic field, titanium targets are mainly used to manufacture semiconductor devices and flat panel displays.

In the optical field, titanium targets are used to manufacture thin film mirrors, filters, etc.

In the field of magnetic materials, titanium targets are used to make magnetic films, etc.

Ti-4N-COA
Ti-4N-Coa


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