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Metal Sputtering Targets

Boron Sputtering Targets (B)

SizeCircular:Diameter≤14 inches, Thickness≥1mm;
Plate:L≤40 inches, W:≤12 inches, Thickness≥1mm
ProcessHot Press Sintering
PackagingVacuum(standard export packing)
ApplicationsPhotovoltaic, semiconductor, chemical industry, machinery industry.,etc.

Boron Sputtering Targets (B) Information

Boron, symbol B. Atomic number 5. Elemental boron is a black or dark brown powder with a melting point of 2076°C. Boiling point 3927℃. Boron is easily oxidized by air, and the formation of boron trioxide film hinders the continued oxidation of internal boron. It can react with fluorine at room temperature and is not corroded by hydrochloric acid and hydrofluoric acid aqueous solutions. Boron is insoluble in water. Powdered boron is soluble in boiling nitric acid and sulfuric acid, as well as most molten metals such as copper, iron, manganese, aluminum and calcium.

Material TypeBoron
Symbol B
Atomic Weight 10.811
Atomic Number 5
Color/Appearance Black, Semi-metallic
Thermal Conductivity 27 W/m.K
Melting Point (°C) 2079
Coefficient of Thermal Expansion 6 x 10-6/K
Theoretical Density (g/cc)2.34
Z Ratio 0.389
Sputter RF
Max Power Density 20*
(Watts/Square Inch)
Type of Bond Indium
Comments Explodes with rapid cooling. Forms carbide with container.

Our boron target is up to 99.9% and is annealed by hot press sintering process. Low gas content and uniform particle size distribution.

Boron alloy targets are often used in photovoltaic, semiconductor, chemical industry, machinery industry. etc.

We sell these different shape boron metal materials by unit weight or piece for different use in research area and for new proprietary technologies.Actual prices can vary and may be higher or lower, as determined by availability and market fluctuations. To speak to someone directly about current pricing, please click inquiry.