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High Specific Gravity Copper Alloy Electronic Packaging

High Specific Gravity Copper Alloy Electronic Packaging

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Tungsten Copper Packaging Material (WCu)

Attributes NamePackaging Material
Product NameTungsten Copper Packaging Material
Element SymbolWCu
Purity2N, 3N, 4N

Physical and chemical properties

It is a composite material of tungsten and copper. It has both the low expansion characteristics of tungsten and the high thermal conductivity of copper. Its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material.

Tungsten copper materials can form a good thermal expansion match with ceramic materials, conductor materials, metal materials, etc., and are mainly used in radio frequency, microwave, semiconductor high-power packaging, optical communication and other industries.

No sintering activation elements such as Fe and Co are added to maintain high thermal conductivity.

2. Excellent air tightness.

3. Provide semi-finished products or finished products with Ni/Au plating on the surface.

4. Good size control, surface finish and flatness.

GradeElementContentDensity( g/cm3)Thermal expansion coefficiant ( ppm/K)Thermal Conductivity ( W/m.K)

Other Packing MaterialsSymbolCustomize
Molybdenum Copper Packaging Material(MoCu)
Tungsten Copper Packaging Material(WCu)
Copper Molybdenum Copper Packaging Material(CuMoCu)
Copper Molybdenum Copper Copper Packaging Materials(CuMoCuCu)