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High Specific Gravity Copper Alloy Electronic Packaging

High Specific Gravity Copper Alloy Electronic Packaging

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Molybdenum Copper Packaging Material (MoCu)


Attributes NamePackaging Material
Product NameMolybdenum Copper Packaging Material
Element SymbolMoCu
Purity2N, 3N, 4N
ShapeCustomize
Overview

Physical and chemical properties

It is a composite material of molybdenum and copper, and its performance is similar to that of tungsten and copper, and it also has adjustable thermal expansion coefficient and thermal conductivity.

However, the density of molybdenum copper is much lower than that of tungsten copper, so it is more suitable for aerospace and other fields.

1. No sintering activation elements such as Fe and Co are added to maintain high thermal conductivity.

2. Excellent air tightness.

3. Smaller density, more suitable for flight electronic equipment.

4. When the molybdenum content does not exceed 75%, rolled plates can be provided for easy punching of parts.

5. Provide semi-finished products or finished products with Ni/Au plating on the surface.

Other Packing MaterialsSymbolCustomize
Molybdenum Copper Packaging Material(MoCu)
Tungsten Copper Packaging Material(WCu)
Copper Molybdenum Copper Packaging Material(CuMoCu)
Copper Molybdenum Copper Copper Packaging Materials(CuMoCuCu)


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