Molybdenum Copper Packaging Material (MoCu)

Physical and chemical properties

It is a composite material of molybdenum and copper, and its performance is similar to that of tungsten and copper, and it also has adjustable thermal expansion coefficient and thermal conductivity.

However, the density of molybdenum copper is much lower than that of tungsten copper, so it is more suitable for aerospace and other fields.

1. No sintering activation elements such as Fe and Co are added to maintain high thermal conductivity.

2. Excellent air tightness.

3. Smaller density, more suitable for flight electronic equipment.

4. When the molybdenum content does not exceed 75%, rolled plates can be provided for easy punching of parts.

5. Provide semi-finished products or finished products with Ni/Au plating on the surface.