Copper Molybdenum Copper Copper Packaging Materials (CuMoCuCu)

Physical and chemical properties

It is a sandwich composite similar to Cu/Mo/Cu, consisting of a Mo70-Cu alloy core layer and two copper cladding layers.

The thickness ratio of Cu:Mo-Cu:Cu was 1:4:1. It has different CTEs in X and Y directions, higher thermal conductivity and cheaper than W(Mo)-Cu, Cu/Mo/Cu. All types of Cu/Mo70Cu/Cu sheets can be punched into assemblies.

Large size paper available (length up to 400mm, width up to 200mm)

Easier to stamp into components than CMC

Extremely strong interfacial bonding, can repeatedly resist 850 ℃ thermal shock

Higher thermal conductivity and lower cost, non-magnetic

Application:

The coefficient of expansion and thermal conductivity can be designed for RF, microwave and semiconductor high power devices.