High Specific Gravity Copper Alloy Electronic Packaging

Materials	Density	Thermal conductivity	Thermal expansion coefficient	Electroplating	Machinability	Weldability	Formability
Cu	8.9	385	16	Excellent	Excellent	Excellent	Excellent
Ti	4.5	17	8.9	Medium	Medium	Medium	Medium
Fe	7.8	52	12.2	Excellent	Excellent	Excellent	Excellent
Mo	10.3	140	5.2	Medium	Bad	Bad	Bad
Al6061	2.7	195	23	Excellent	Excellent	Excellent	Excellent
4J29	8.4	15	6	Excellent	Excellent	Excellent	Excellent
WCu	16.4	180	6.8	Medium	Medium	Medium	Medium
MoCu	10	165	6.8	Medium	Medium	Medium	Medium
CuMoCu	9.5	170	6.8	Medium	Excellent	Excellent	Excellent
CuMoCuCu	9.5	175	6.8	Medium	Medium	Medium	Medium
Al65SiC35	3	170	6.8	Bad	Bad	Bad	Bad
AlSi27-70	2.5	140	11.5	Excellent	Excellent	Excellent	Excellent