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High-silicon Aluminum Alloy Electronic Packaging

High-silicon Aluminum Alloy Electronic Packaging

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High-silicon Aluminum Alloy Electronic Packaging

High-silicon Aluminum Alloy Electronic Packaging


Overview

Materials Density Thermal conductivity Thermal expansion coefficient Electroplating Machinability Weldability Formability
Cu 8.9 385 16 Excellent Excellent Excellent Excellent
Ti 4.5 17 8.9 Medium Medium Medium Medium
Fe 7.8 52 12.2 Excellent Excellent Excellent Excellent
Mo 10.3 140 5.2 Medium Bad Bad Bad
Al6061 2.7 195 23 Excellent Excellent Excellent Excellent
4J29 8.4 15 6 Excellent Excellent Excellent Excellent
WCu 16.4 180 6.8 Medium Medium Medium Medium
MoCu 10 165 6.8 Medium Medium Medium Medium
CuMoCu 9.5 170 6.8 Medium Excellent Excellent Excellent
CuMoCuCu 9.5 175 6.8 Medium Medium Medium Medium
Al65SiC35 3 170 6.8 Bad Bad Bad Bad
AlSi27-70 2.5 140 11.5 Excellent Excellent Excellent Excellent