Evaporation Materials

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• Evaporation Materials

  Aluminium (Al) Evaporation Pellets

  Aluminium Oxide (Al2O3) Evaporation Granules

  Beryllium (Be) Evaporation Pellets

  Boron (B) Evaporation Pellets

  Chromium (Cr) Evaporation Pellets

  Cobalt (Co) Evaporation Pellets

  Copper (Cu) Evaporation Pellets

  Dysprosium (Dy) Evaporation Pellets

  Germanium (Ge) Evaporation Pellets

  Gold (Au) Evaporation Pellets

  Hafnium (Hf) Evaporation Pellets

  Hafnium Oxide (HfO2) Evaporation Granules

  Holmium (Ho) Evaporation Pellets

  Iron (Fe) Evaporation Pellets

  Magnesium Fluoride (MgF2) Evaporation Granules

  Molybdenum (Mo) Evaporation Pellets

  Nickel (Ni) Evaporation Pellets

  Niobium (Nb) Evaporation Pellets

  Niobium Oxide (Nb2O5) Evaporation Granules

  Silicon (Si) Evaporation Granules

  Silicon Dioxid (SiO2) Evaporation Granules

  Silver (Ag) Evaporation Pellets

  Tantalum (Ta) Evaporation Pellets

  Tantalum Oxide (Ta2O5) Evaporation Granules

  Tin (Sn) Evaporation Pellets

  Titanium (Ti) Evaporation Pellets

  Vanadium (V) Evaporation Pellets

  Titanium Oxide (TiO2) Evaporation Granules

  Titanium Pentoxide (Ti3O5) Evaporation Granules

  Yttrium (Y) Evaporation Granules

  Yttrium Oxide (Y2O3) Evaporation Granules

  Zinc (Zn) Evaporation Pellets

  Zinc Sulfide (ZnS) Evaporation Granules

  Zirconium (Zr) Evaporation Pellets

Product Characteristics

The physical process of evaporation includes:

The deposition material is evaporated or sublimated into gaseous particles → gaseous particles are quickly transported from the evaporation source to the substrate surface → gaseous particles attach to the substrate surface to nucleate and grow into a solid film → film atomic reconstruction or chemical bonding occurs.

Put the substrate into the vacuum chamber, heat the film material by means of resistance, electron beam, laser, etc., to evaporate or sublimate the film material, and gasify it into particles (atoms, molecules or atomic groups) with certain energy (0.1-0.3eV).

The gaseous particles are rapidly transported to the substrate in a linear motion without collision. Part of the particles that reach the surface of the substrate are reflected, and the other part is adsorbed on the substrate and diffuses on the surface. Two-dimensional collisions occur between deposited atoms to form clusters. It may remain on the surface for a short time before evaporating.

Particle clusters constantly collide with diffusing particles, or absorb single particles, or emit single particles.

This process is repeated. When the number of aggregated particles exceeds a certain critical value, it becomes a stable nucleus, and then continues to absorb and diffuse particles to grow gradually. Finally, a continuous film is formed through the contact and merger of adjacent stable nuclei.

3 Ways of Evaporation

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  Resistance evaporation

  Principle of resistance evaporation: Materials with an evaporation temperature of 1000-2000 ° C can be heated by resistance as an evaporation source. The heater generates heat after the resistance is energized, and the heat generated makes the molecules or atoms of the evaporation material obtain enough kinetic energy to evaporate.

  
  

  Advantages of electric rent evaporation:

  1. The evaporation source is generally filamentous (0.05-0.13cm), easy to operate, cheap consumables, and easy to replace.

  2. The evaporating material must wet the heating wire and be supported by surface tension. Only metal or alloy can be evaporated, and the heating wire is easy to become brittle.

  3. Commonly used evaporation source materials are: W, Mo, Ta, high temperature resistant metal oxide, ceramic or graphite crucible.

  Disadvantages of electric rent evaporation: there may be a reaction between the support material and the evaporator; the general working temperature is 1500~1900 ℃, it is difficult to achieve a higher evaporation temperature, so the evaporable materials are limited; the evaporation rate is low; the heating rate is not high, If the material to be evaporated during evaporation is an alloy or compound, it may decompose or have a different evaporation rate, causing the composition of the film to deviate from the composition of the evaporated material. At high temperature, tantalum and gold form alloys, aluminum, iron, nickel, cobalt, etc. form alloys with tungsten, molybdenum, tantalum, etc., and tungsten, molybdenum reacts with water or oxygen to form volatile oxide gases.

• 

  Electron beam evaporation

  
  

  The principle of electron beam evaporation:

  The electron beam is accelerated after passing through an electric field of 5-10KV, and then focused on the surface of the material to be evaporated, and the energy is transferred to the material to be evaporated to melt and evaporate.

  
  

  Advantages of electron beam evaporation:

  1. The evaporation of refractory substances can be realized, and rapid evaporation can be realized with a large power density to prevent the separation of alloys.

  2. Multiple crucibles can be placed at the same time, and a variety of different substances can be evaporated at the same time or separately;

  3. Pollution-free. Most electron beam evaporation systems use magnetic focusing or magnetic bending electron beams. The evaporated material is placed in a water-cooled crucible, and the material to be evaporated that is in contact with the crucible (water-cooled crucible) remains solid and evaporates on the surface of the material.

  Effectively inhibit the reaction between the crucible and the evaporation material, the possibility of the reaction between the evaporation material and the crucible is very small, suitable for the preparation of high-purity thin films, and can prepare thin film materials in the fields of optics, electronics and optoelectronics, such as Mo, Ta, Nb, MgF2, Ga2Te3, TiO2, Al2O3, SnO2, Si, etc.; vaporized molecular kinetic energy is larger, and a firmer and denser film can be obtained than resistance heating.

  Disadvantages of electron beam evaporation: It can ionize the evaporated gas and residual gas, which sometimes affects the quality of the film layer; the structure of the electron beam evaporation device is complex and expensive; the X-rays generated have certain damage to the human body.

• 

  laser evaporation

  Principle of laser evaporation: The laser is used as a heat source, and the high-energy laser beam passes through the window of the vacuum chamber to heat the evaporated material to the sublimation point, turn it into a gas, and deposit it into a film.

  
  

  Advantages of laser evaporation:

  1. use non-contact heating, reduce pollution, simplify the vacuum chamber, suitable for preparing pure films under ultra-vacuum;

  2. The heat source is clean, without pollution from the heating body;

  3. Focusing can obtain high power, and can deposit high melting point materials such as ceramics and complex composition materials (instantaneous evaporation);

  4. The beam is concentrated, the laser device can be placed at a long distance, and some special material films (such as highly radioactive materials) can be safely deposited;

  5. High evaporation rate, film has high adhesion.

  Disadvantages of laser evaporation: it is difficult to control the film thickness; it can cause overheating decomposition and sputtering of compounds; the cost of laser evaporation equipment is relatively high.

Why Choose Us

• Strict Quality Control: Complete testing equipment and system.

• Complete Category: Covering all metal elements.

• Different shape : Granules, Powders, Flakes, Rods, Plates and Rings etc.

• Different Purity: From 2N7-6N5, 99.7%-99.9999% Purity,Even Higher.